PITTSBURGH, April 14, 2021 /PRNewswire/ —
/ Key Highlights
- H3C Semiconductor designers used Ansys’ comprehensive multiphysics platform — including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC — to engineer a state-of-the-art network processor chip featuring 56G Serdes and LPDDR5 interfaces
- Using Ansys solutions, H3C Semiconductor designers managed multifaceted design issues from chip design to signoff, co-simulating the chip and package to power advanced routing, 5G backhaul, artificial intelligence (AI) and cybersecurity applications
H3C Semiconductor leveraged Ansys (NASDAQ: ANSS) simulation solutions to launch ENGIANT 660, a highly sophisticated network processor chip that enables routing, AI, 5G backhaul and cybersecurity applications. H3C Semiconductor designers used Ansys’ cutting-edge multiphysics simulation platform to enhance product signoff efficiency, spur product development and pass stringent testing requirements.
To innovate a large-scale complex network processor chip for advanced processes, reduce development costs and solve a myriad of complicated design issues, H3C Semiconductor designers employed a broad spectrum of multiphysics simulation solutions. Ansys solutions empowered designers to perform comprehensive analysis of power noise, signal integrity, thermal reliability and structural dependability from chip…
